Methods and structures for electrostatic discharge protection

ABSTRACT

A semiconductor device includes a first well region of a first conductivity type, a second well region of a second conductive type within the first well region. A first region of the first conductivity type and a second region of the second conductivity type are disposed within the second well region. A third region of the first conductivity type and a fourth region of the second conductivity type are disposed within the first well region, wherein the third region and the fourth region are separated by the second well region. The semiconductor device also includes a switch device coupled to the third region.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 12/410,335, filed Mar. 24, 2009, which is acontinuation-in-part of U.S. patent application Ser. No. 12/264,879,filed Nov. 4, 2008, both of which are commonly assigned and incorporatedin their entirety by reference for all purposes.

BACKGROUND OF THE INVENTION

Semiconductor devices in an integrated circuit are susceptible todamages caused by electro-static discharge (ESD). ESD can be induced bythe motion of static electricity generated from a non-conductivesurface. For example, a human body moving on a carpet may gatherthousands of volts of static electricity. Moreover, in integratedcircuits testing or packaging environment, even higher staticelectricity may be generated. The high energy pulses of theelectro-static discharge (ESD) can cause severe damage to the devices inthe integrated circuits.

To prevent the damage of the integrated circuits due to theelectro-static discharge, an ESD protection circuit is often included inthe integrated circuit. Conventionally, in an MOS or CMOS integratedcircuit, the ESD protection circuit often includes parasitic bipolarjunction transistor (ex. NPN) or a silicon control rectifier (SCR) whichis turned on by the high voltage pulses in an ESD event. For example, ina lateral double-diffused MOSFET (LDMOS), a conventional ESD protectionstructure includes a p-type contact region near a drain region of theLDMOS device. As a result, a parasitic SCR is formed by the p-typecontact, the n-well, the p-substrate, the source region. Such an SCR isturned on, or triggered, to provide a current discharge path, if a highvoltage at the drain contact pad is high enough to cause an avalanchebreakdown at the junction between the n-well and p-substrate.

Even though conventional ESD protection structures are useful in someapplications, many limitations still exist. For example, conventionalESD protection structures often have high trigger voltages. In certainapplications, such high trigger voltages do not provide adequate ESDprotection to the integrated circuit. These and other limitations aredescribed throughout the present specification and more particularlybelow.

From the above, it is seen that an improved technique for ESD protectionin semiconductor devices is desired.

BRIEF SUMMARY OF THE INVENTION

The present invention is directed to integrated circuits. Moreparticularly, the invention provides a device for integrated circuitshaving electrostatic discharge (ESD) protection structure for providingan ESD current path having a lower trigger voltage than a conventionalsilicon controlled rectifier (SCR). Merely by way of example, theinvention has been applied LDMOS lateral double-diffused MOSFET (LDMOS),high voltage filed transistors, and low voltage MOSFET for improved ESDprotection. But it would be recognized that the invention has a muchbroader range of applicability.

According to a specific embodiment, the invention provides asemiconductor device which includes a first well region of a firstconductivity the first well region includes a first well contact regionof the first conductivity type for coupling to a first potential. Thedevice includes a source region of the second conductivity type withinthe first well region and coupled to the first potential. A second wellregion of the second conductivity type is disposed adjacent to the firstwell region. The second well region includes a first portion and asecond portion. The device also includes a drain region of the secondconductivity type. At least a portion of the drain region is disposedwithin the first portion of the second well region. Additionally, thedevice includes a third doped region of the first conductivity type inthe first portion of the second well region. The third doped region isadjacent to the drain region and electrically coupled to the drainregion. The device also includes a fourth doped region of the secondconductivity type within the second portion of the second well region.The fourth doped region is adjacent to the source region. The devicefurther includes a switch device coupled to the fourth doped region. Inthe semiconductor device also includes a first transistor coupled to theswitch device through the fourth doped region. The first transistorincludes the third doped region, the second well region, and the firstwell region. A second transistor includes the second well region, thefirst well region, and the source region. The first and the secondtransistors are configured to provide a current path during an ESDevent. According to embodiments of the invention, the current path istriggered at a lower trigger voltage than a conventional SCR ESDprotection device.

In a specific embodiment of the device, the first conductivity type isp-type, and the second conductivity type is n-type. In an embodiment,the first potential is a ground potential. The switch device can be adiode. A first terminal of the diode is coupled to the fourth dopedregion and a second terminal of the diode is coupled to a power supplypotential. In another embodiment, the switch device includes a MOSFET. Afirst terminal of the MOSFET is coupled to the fourth doped region, anda second terminal of the MOSFET is coupled to the first potential. Agate terminal of the MOSFET is electrically coupled to the drain regionthrough a capacitor and electrically coupled to the first potentialthrough a resistor.

In another embodiment of the semiconductor device, the semiconductordevice includes a lateral double diffused MOSFET (LDMOS), which includesa channel region in the first well region, a gate dielectric overlyingthe channel region, a field oxide region between the channel region andthe drain region, and a gate electrode overlying the gate dielectric andthe field oxide region. In another embodiment the semiconductor deviceincludes a high voltage field transistor, which has a field oxide regionbetween the source region and the drain region. In yet anotherembodiment, the semiconductor device includes a low voltage MOSFET,which further includes a channel region in the first well region betweenthe source region and the drain region and a gate dielectric overlyingthe channel region, and a gate electrode overlying the gate dielectric.At least a portion of the drain region is within the first well region.

According to an alternative embodiment, a semiconductor device includesa p-type well region, which has a first well contact for coupling to aground potential. The device includes an n-type source region within thep-type well region. The source region is coupled to the groundpotential. The device includes an n-type well region adjacent to thep-type well region. The n-type well region includes a first portion anda second portion. The device also includes an n-type drain region. Atleast a portion of the drain region is within the first portion of then-type well region. The p-type doped region is adjacent to the drainregion and electrically coupled to the drain region. The device alsoincludes an n-type doped region within the second portion of the n-typewell region. The n-type doped region is adjacent to the source region.The device further includes a switch device coupled to the n-type dopedregion. Additionally, the device includes two transistors. The firsttransistor includes the p-type doped region, the n-type well region, andthe p-type well region. The first transistor is coupled to the switchdevice through the n-type doped region. The second transistor includesthe n-type drain region, the p-type well region, and the n-type sourceregion. When an ESD event occurs, a current path is provided to forwardbias the base-emitter junction of first transistor and turn on the firsttransistor. The base-emitter junction of the second transistor isforwarded biased due to turn-on current of first device, and the secondtransistor is also turned on. Thus, the first and the second transistorsprovide a current path during an ESD event.

In a specific embodiment the switch device includes a diode. A firstterminal of the diode is coupled to the fourth doped region, and asecond terminal of the diode is coupled to a power supply potential. Inanother embodiment, the switch device includes a MOSFET. A firstterminal of the MOSFET is coupled to the fourth doped region, and asecond terminal of the MOSFET is coupled to the first potential. In anembodiment, a gate terminal of the MOSFET is electrically coupled to thedrain region through a capacitor and electrically coupled to the firstpotential through a resistor.

According to another alternative embodiment, a semiconductor deviceincludes a first well region of a first conductivity type, a second wellregion of a second conductive type within the first well region. A firstregion of the first conductivity type and a second region of the secondconductivity type are disposed within the second well region. A thirdregion of the first conductivity type and a fourth region of the secondconductivity type are disposed within the first well region, wherein thethird region and the fourth region are separated by the second wellregion. The semiconductor device also includes a switch device coupledto the third region.

Many benefits are achieved by way of the present invention overconventional techniques. For example, in an embodiment, the inventionprovides ESD protection structures having lower trigger voltages forimproved ESD protection. In specific embodiments, the improved ESDprotection structures include a switch device coupled to an ESD currentpath. In various embodiments, the invention provides improved ESDprotection structures for various devices, such as LDMOS, high voltagefield transistor, and low voltage MOSFET. Depending upon the embodiment,one or more of these benefits may be achieved. These and other benefitswill be described in more detail throughout the present specificationand more particularly below.

Various additional objects, features and advantages of the presentinvention can be more fully appreciated with reference to the detaileddescription and accompanying drawings that follow.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified cross-sectional view diagram of a lateral doublediffused MOSFET (LDMOS) device according to an embodiment of the presentinvention;

FIG. 2 is a simplified layout diagram of the LDMOS device of FIG. 1according to an embodiment of the present invention;

FIG. 3 is a simplified schematic diagram of the LDMOS device of FIG. 1according to an embodiment of the present invention;

FIG. 4 is a simplified cross-sectional view diagram of the LDMOS deviceaccording to another embodiment of the present invention;

FIG. 5 is a simplified cross-sectional view of a high voltage fieldtransistor according to an embodiment of the present invention;

FIG. 6 is a simplified cross-sectional view diagram of a low voltage MOSdevice according to another embodiment of the present invention;

FIG. 7 is a simplified layout diagram of a low voltage MOSFET device ofFIG. 6 according to an embodiment of the present invention;

FIG. 8 is a simplified cross-sectional view diagram of an LDMOS deviceaccording to another embodiment of the present invention;

FIG. 9 is a simplified layout diagram of the LDMOS device of FIG. 8according to an embodiment of the present invention;

FIG. 10 is a simplified schematic diagram of the LDMOS device of FIG. 8according to an embodiment of the present invention;

FIG. 11 is a simplified cross-sectional view diagram of an LDMOS deviceaccording to an alternative embodiment of the present invention;

FIG. 12 is a simplified cross-sectional view diagram of a high voltagefield transistor of FIG. 11 according to another embodiment of thepresent invention;

FIG. 13 is a simplified cross-sectional view diagram of a low voltageMOSFET device according to another embodiment of the present invention;

FIG. 14 is a simplified layout diagram of the low voltage MOSFET deviceof FIG. 13 according to an embodiment of the present invention;

FIG. 15 is a simplified cross-sectional view diagram of a high voltagefield transistor according to another embodiment of the presentinvention;

FIG. 16 is a simplified schematic diagram of FIG. 15 according to anembodiment of the present invention;

FIG. 17 is a simplified layout diagram of the high voltage fieldtransistor of FIG. 15 according to an embodiment of the presentinvention;

FIG. 18 is a simplified cross-section view diagram of the high voltagefield device according to another embodiment of the present invention;

FIG. 19 is a simplified schematic diagram of the high voltage fielddevice of FIG. 18 according to an embodiment of the present invention;and

FIG. 20 is a simplified layout diagram of the high voltage device ofFIG. 18 according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed to integrated circuits. Moreparticularly, the invention provides a device for integrated circuitshaving electrostatic discharge (ESD) protection structure for providingan ESD current path which has a lower trigger voltage than a conventionnpn bipolar and silicon controlled rectifier (SCR). Merely by way ofexample, the invention has been applied to LDMOS lateral double-diffusedMOSFET (LDMOS), high voltage field transistors, and low voltage MOSFETfor improved ESD protection. But it would be recognized that theinvention has a much broader range of applicability.

As discussed above, conventional ESD protection device structures basedon SCR often have high trigger voltages. In a conventional ESDprotection structure, the SCR and npn are often turned on, or triggered,if a high voltage at the drain contact pad is high enough to cause anavalanche breakdown at the junction between the n-well and p-substrate.This tends to result in a high trigger voltage, for example, 40-50V orhigher. The conventional ESD protection structures also suffer fromother limitations. Accordingly, an improved technique for ESD protectionstructures in semiconductor devices is highly desired.

Depending upon the embodiment, the present invention includes variousfeatures, which may be used. These features include the following:

-   -   1. ESD protection structures for providing a lower trigger        voltage for improved ESD protection;    -   2. Improved ESD protection structures including a switch device        coupled to an ESD current path; and    -   3. Improved ESD protection structures for various devices, such        as LDMOS, high voltage field transistor, and low voltage MOSFET.

A shown, the above features may be in one or more of the embodiments tofollow. These features are merely examples, which should not undulylimit the scope of the claims herein. One of ordinary skill in the artwould recognize many variations, modifications, and alternatives.

FIG. 1 is a simplified cross-sectional view diagram of a lateral doublediffused MOSFET (LDMOS) device according to an embodiment of the presentinvention. This diagram is merely an example, which should not undulylimit the scope of the claims herein. One of ordinary skill in the artwould recognize other variations, modifications, and alternatives. Asshown, LDMOS device 100 is a semiconductor device, e.g., a silicondevice, which includes a p-type well region 101. The p-type well region101 includes a first well contact 102 for coupling to a ground potential141. Device 100 also includes an n-type source region 103 within thep-type well region 101, and the source region 103 is also coupled to theground potential 141. Device 100 includes an n-type well region 111adjacent to the p-type well region 101.

In the cross-sectional view of FIG. 1, n-type well region 111 is shownas two separate regions. In some embodiments, the n-type well region caninclude multiple regions which are contiguous. In FIG. 1, the firstportion 111 a is the n-well region on the right-hand side of the figure,and the second portion 111 b is the n-well region on the left-hand sideof the figure. In a specific embodiment, the first portion and thesecond portion are contiguous regions. Device 100 also includes ann-type drain region 112, and at least a portion of the drain region iswithin the n-type well region 111. In FIG. 1, the n-type drain region112 is located within the first portion of the n-type well region 111 a,but in other embodiments, part of the n-type drain region can beextended outside the n-type well region.

In FIG. 1, a p-type doped region 113 is disposed in the n-type wellregion 111. As shown, the p-type doped region 113 is adjacent to thedrain region 112 and electrically coupled to the drain region 112. Insome embodiments, the p-type dope region 113 may be positioned next todrain region 112, but in other embodiments, there can be a suitabledistance between the p-type doped region 113 and the drain region 112according to device or layout requirements. As shown in FIG. 1, then-type drain region 112 and the p-type doped region 113 are electricallyconnected to a pad 143. Device 100 also includes an n-type doped region115 within a portion of the n-type well region 111 which is close to thesource region 103. Device 100 also includes a diode device 131 whichelectrically couples the n-type doped region 115 to a power supplypotential 142 (VDD).

As shown in FIG. 1, the LDMOS 100 also includes a channel region 131 inthe p-type well region 101 and a gate dielectric 132 overlying thechannel region. The LDMOS 100 also includes field oxide regions 136,137, and 138. A gate electrode 133 overlies the gate dielectric 132 andfield oxide region 133. As shown, field oxide region 137 is disposedbetween the channel region 131 and the drain region 112.

In FIG. 1, the p-type doped region 113, the first portion of the n-typewell region 111 a close to the drain region 112, and n-type well region111 form a PNP transistor. Similarly, the n-type well region 111, thep-type well region 101 and the second portion of the n-type well region111 b close to the source region 103 form an NPN transistor. Furtherdetails of the LDMOS device are discussed below with reference to FIGS.2 and 3.

FIG. 2 is a simplified layout diagram of the LDMOS device of FIG. 1according to an embodiment of the present invention. This diagram ismerely an example, which should not unduly limit the scope of the claimsherein. In FIGS. 1 and 2, corresponding device regions are labeled withthe same numerals. One of ordinary skill in the art would recognizeother variations, modifications, and alternatives. As shown, the p-typewell region 101 includes the first well contact 102 for coupling to aground potential (not shown). The n-type source region 103 is locatedwithin the p-type well region. The n-type well region 111 is adjacent tothe p-type well region 101 in FIG. 2, and the p-type well region 101 isshown to be surrounded by the n-type well region 111. An n-type drainregion 112 is located within the n-type well region 111.

In an embodiment, the n-well region includes a first portion and asecond portion. In FIGS. 1 and 2, the first portion 111 a is the n-wellregion on the right-hand side of the figure, and the second portion 111b is the n-well region on the left-hand side of the figure. In aspecific embodiment, the first portion and the second portion arecontiguous regions, as shown in FIG. 2.

In FIG. 2, a p-type doped region 113 is disposed in the n-type wellregion 111. As shown, the p-type doped region 113 is adjacent to thedrain region 112 and electrically coupled to the drain region 112. Insome embodiments, the p-type doped region 113 may be positioned next todrain region 112, but in other embodiments, there can be a suitabledistance between the p-type doped region 113 and the drain region 112according to device or layout requirements. The n-type drain region 112and the p-type doped region 113 are electrically connected to a pad 143.In FIG. 2, several n-type doped regions 115 provide contact regions forthe portion of the n-type well region 111 which is close to the sourceregion 103. Diode device 131 electrically connects the n-type dopedregions 115 to a power supply potential 142 (VDD).

In FIG. 2, the p-type doped region 113, the first portion of the n-typewell region 111 a (not shown in FIG. 2) close to the drain region 112,and p-type well region 101 form a PNP transistor. Similarly, the drainregion 112, the p-type well region 101 and the source region 103 form anNPN transistor. The various well regions and doped regions can be formedusing conventional process technology. For example, doped regions 113and 115 can be formed in an ion implantation process using appropriatep-type or n-type dopants. The operation of the transistors is discussedbelow with reference to the schematic diagram in FIG. 3.

FIG. 3 is a simplified schematic diagram of the LDMOS device of FIG. 1according to an embodiment of the present invention. This diagram ismerely an example, which should not unduly limit the scope of the claimsherein. One of ordinary skill in the art would recognize othervariations, modifications and alternatives. As shown, the p-type dopedregion 113, the n-type well region 111, and the p-type well region 101form a PNP transistor. Similarly, the n-type well region 111, the p-typewell region 101, and the source region 103 form an NPN bipolartransistor. Resistor 145 represents the resistance in the n-type wellregion, and resistor 146 represents the resistance in the p-type wellregion. The p-type doped region 113 is connected to pad 143, and then-type doped region 115 is electrically connected to the diode 131 (D1).In an embodiment, the diode 131 can be formed as a PN junction diodeincluding two doped semiconductor regions. In an alternative embodiment,the diode 131 can be a Schottky diode including a metal and asemiconductor.

In a specific embodiment, the invention provides a technique thatutilizes PN forward diode to provide a current path for an pnp currentflown into P type substrate which raises the substrate voltage and helpsNPN or SCR being turned on while having an ESD event. The switch andpower supply provide a path for PN diode.

When an ESD event occurs, a high voltage pulse appears on pad 143. Acurrent may flow through the p-type doped region 113, the n-type wellregion 111, n-type doped region 115, and diode 131. The PNP transistoris turned on, and a forward bias is provided between the base terminaland the collector terminal of the NPN transistor. A current path isestablished from the n-type well region 111, through the p-type wellregion 101, and n-type source region 103 to the source terminal 141. Asa result, the NPN transistor is triggered and the ESD current can bedirected from the NPN transistor to the source or ground terminal 141.This conduction mechanism does not rely on avalanche breakdown betweenthe n-type well and the p-type well. Therefore, this current conductionis enabled at a lower trigger voltage than conventional npn and SCRstructures, providing better device protection against ESC events. In aspecific embodiment, the trigger voltage of about 24V has been obtainedaccording to an embodiment of the invention. Of course, there can beother variations, modifications, and alternatives.

FIG. 4 is a simplified cross-sectional view diagram of the LDMOS device400 according to another embodiment of the present invention. Thisdiagram is merely an example, which should not unduly limit the scope ofthe claims herein. One of ordinary skill in the art would recognizeother variations, modifications, and alternatives. As shown, LDMOSdevice 400 is similar to the LDMOS device 100 of FIG. 1, with adifferent well arrangement. As shown, p-well 101 is now formed insiden-well 111. Otherwise, the operation of LDMOS device 400 is similar tothat of LDMOS device 100 discussed above. In particular, a PNPtransistor and an NPN transistor provide an ESD current path having alower trigger voltage than conventional NPN and SCR devices.

As shown in FIG. 4, according to some embodiments, a semiconductordevice 400 includes a first well region 111 of a first conductivitytype, a second well region 101 of a second conductive type within thefirst well region 111. In some embodiments, the first conductivity typeis n-type, and the second conductivity type is p-type. In otherembodiments, the conductivity types can be reversed. In FIG. 4, a firstregion 103 of the first conductivity type and a second region 102 of thesecond conductivity type are disposed within the second well region 101.A third region 115 of the first conductivity type and a fourth region113 of the second conductivity type are disposed within the first wellregion 111, wherein the third region 115 and the fourth region 113 areseparated by the second well region 101. The semiconductor device 400also includes a switch device 131 coupled to the third region 115. Inthis example, a PNP transistor (formed by regions 113, 111, and 101) andan NPN transistor (formed by regions 111, 101, and 103) provide an ESDcurrent path having a lower trigger voltage than conventional ESDdevices. Similar ESD devices arrangements are also shown in FIGS. 5, 11,12, 15, and 18 described below.

FIG. 5 is a simplified cross-sectional view of a high voltage fieldtransistor according to an embodiment of the present invention. Thisdiagram is merely an example, which should not unduly limit the scope ofthe claims herein. One of ordinary skill-in the art would recognizeother variations, modifications, and alternatives. As shown, fieldtransistor 500 is similar to the LDMOS device 400 of FIG. 4, with adifferent gate arrangement. As shown, the field oxide 137 forms the gatedielectric of the high voltage field transistor. Otherwise, the ESDprotection operation of field transistor 500 is similar to that of LDMOSdevices 400 and 100 discussed above. In particular, a PNP and an NPNtransistors provide an ESD current path having a lower trigger voltagethan conventional NPN and SCR devices.

FIG. 6 is a simplified cross-sectional view diagram of a low voltageMOSFET device according to another embodiment of the present invention.This diagram is merely an example, which should not unduly limit thescope of the claims herein. One of ordinary skill in the art wouldrecognize other variations, modifications, and alternatives. As shown,low voltage MOSFET 600 is similar to the LDMOS device 100 of FIG. 1,with low voltage MOSFET replacing the LDMOS. As shown, gate 133 nowoverlies gate dielectric 132, and drain region 112 resides partly in thep-type well 101 and partly in the n-type well 111. Otherwise, the ESDprotection operation of LDMOS device 400 is similar to that of LDMOSdevice 100 discussed above. In particular, a PNP and an NPN transistorsprovide an ESD current path having a lower trigger voltage thanconventional npn and SCR devices.

FIG. 7 is a simplified layout diagram of a low voltage MOSFET device ofFIG. 6 according to an embodiment of the present invention. This diagramis merely an example, which should not unduly limit the scope of theclaims herein. One of ordinary skill in the art would recognize othervariations, modifications, and alternatives. As shown, the layoutdiagram is similar to the layout diagram of FIG. 2 for LDMOS device 100with drain region 112 now residing partly in the p-type well 101 andpartly in the n-type well 111.

FIG. 8 is a simplified cross-section view diagram of an LDMOS deviceaccording to another embodiment of the present invention. This diagramis merely an example, which should not unduly limit the scope of theclaims herein. One of ordinary skill in the art would recognize othervariations, modifications, and alternatives. As shown, LDMOS device 800is similar to LDMOS device 100 of FIG. 1, with an RC-triggered MOSFETreplacing the diode as the switch device coupled to an ESD current path.In FIG. 8, an ESD current path is provided by an RC triggered MOSFET,including resistor 150, capacitor 153, and n-type MOSFET 155. Accordingto embodiments of the invention, the resistance of the resistor 150 andthe capacitance of 153 are selected such that MOSFET 155 is turned on bythe high voltage pulse of an ESD event, providing a current path fromthe pad through the parasitic forward diode and also through MOSFET 155to a ground potential. During normal device operation, MOSFET 155remains turned off, and no current flows through MOSFET 155. During ESDevent, p-type doped region 113, n-type well region 111, n-type dopedregion 115, and the RC-triggered MOSFET provide a current path. Thisspecific embodiment utilizes PN forward diode to provide a pnp currentflown into P type substrate which raises the substrate voltage and helpsnpn or SCR being turned on while having an ESD event. The switch andpower supply provide a path for PN diode. While an ESD event exists, RCis coupled to the voltage of PAD and MOS is turned on. PNP current pathhas been formed.

This current flow provides a positive bias at the base-collectorjunction of NPN transistor formed by n-type well region 111, p-type wellregion 101, and n-type doped region 103. The NPN transistor is thentriggered to provide a current path for the ESC current. As discussedabove, this design enables a reduced trigger voltage than conventionalnpn and SCR devices. In an embodiment, MOSFET 155, resistor 150, andcapacitor 153 can be formed in the same semiconductor substrate as theLDMOS using conventional integrated circuit process technology.

FIG. 9 is a simplified layout diagram of the LDMOS device of FIG. 8according to an embodiment of the present invention. This diagram ismerely an example, which should not unduly limit the scope of the claimsherein. One of ordinary skill in the art would recognize othervariations, modifications, and alternatives. As shown, the layoutdiagram in FIG. 9 is similar to the layout diagram in FIG. 2, with anRC-triggered MOSFET replacing the diode as the switch device coupled toan ESD current path.

FIG. 10 is a simplified schematic diagram of the LDMOS device of FIG. 8according to an embodiment of the present invention. This diagram ismerely an example, which should not unduly limit the scope of the claimsherein. One of ordinary skill in the art would recognize othervariations, modifications, and alternatives. As shown, the schematicdiagram in FIG. 10 is similar to the schematic diagram in FIG. 3, withan RC-triggered MOSFET replacing the diode as the switch device coupledto an ESD current path.

FIG. 11 is a simplified cross-sectional view diagram of an LDMOS deviceaccording to an alternative embodiment of the present invention. Thisdiagram is merely an example, which should not unduly limit the scope ofthe claims herein. One of ordinary skill in the art would recognizeother variations, modifications, and alternatives. As shown, LDMOSdevice 1100 is similar to the LDMOS device 400 of FIG. 4, with anRC-triggered MOSFET replacing the diode as the switch device coupled tothe current path. The ESD protection operation of LDMOS device 1100 issimilar to that LDMOS device 800 discussed above. In particular, twotransistors provide an ESD current path having a lower trigger voltagethan conventional npn and SCR devices.

FIG. 12 is a simplified cross-sectional view diagram of a high voltagefield transistor of FIG. 11 according to another embodiment of thepresent invention. This diagram is merely an example, which should notunduly limit the scope of the claims herein. One of ordinary skill inthe art would recognize other variations, modifications, andalternatives. As shown, field transistor 1200 is similar to the fieldtransistor 500 of FIG. 5, with an RC-triggered MOSFET replacing thediode as the switch device coupled to an ESD current path. The ESDprotection operation of field transistor 1200 is similar to that ofLDMOS device 800 discussed above. In particular, a transistor providesan ESD current path having a lower trigger voltage than conventional npnand SCR devices.

FIG. 13 is a simplified cross-sectional view diagram of a low voltageMOSFET device according to another embodiment of the present invention.This diagram is merely an example, which should not unduly limit thescope of the claims herein. Once of ordinary skill in the art wouldrecognize other variations, modifications, and alternatives. As shown,low voltage MOSFET device 1300 is similar to the low voltage MOSFETdevice 600 of FIG. 6, with an RC-triggered MOSFET replacing the diode asthe switch device coupled to an ESD current path. The ESC protectionoperation of low voltage MOSFET device 1300 is similar to that of LDMOSdevice 800 discussed above. In particular, two transistors provide anESD current path having a lower trigger voltage than conventional npnand SCR devices.

FIG. 14 is a simplified layout diagram of the low voltage MOSFET deviceof FIG. 13 according to an embodiment of the present invention. Thisdiagram is merely an example, which should not unduly limit the scope ofthe claims herein. One of ordinary skill in the art would recognizeother variations, modifications, and alternatives. As shown, the layoutdiagram for low voltage MOSFET device 1300 is similar to the layoutdiagram in FIG. 7 for the low voltage MOSFET device 600 of FIG. 6, withan RC-triggered MOSFET replacing the diode as the switch device.

FIG. 15 is a simplified cross-sectional view diagram of a high voltagefield transistor according to another embodiment of the presentinvention. This diagram is merely an example, which should not undulylimit the scope of the claims herein. One of ordinary skill in the artwould recognize other variations, modifications, and alternatives. Asshown, field transistor 1500 is similar to the field transistor 500 ofFIG. 5, without the field oxide region 137 and the n-type drain region112.

FIG. 16 is a simplified schematic diagram of the high voltage fielddevice of FIG. 15 according to an embodiment of the present invention.This diagram is merely an example, which should not unduly limit thescope of the claims herein. One of ordinary skill in the art wouldrecognize other variations, modifications and alternatives. As shown,the p-type doped region 113, the n-type well region 111, and the p-typewell region 101 form a PNP transistor. Similarly, the n-type well region111, the p-type well region 101, and the source region 103 form an NPNbipolar transistor. The p-type doped region 113 is connected to pad 143,and the n-type doped region 115 is electrically connected to the diode131 (D1). In an embodiment, the diode 131 can be formed as a PN junctiondiode including two doped semiconductor regions. In an alternativeembodiment, the diode 131 can be a Schottky diode including a metal anda semiconductor.

When an ESD event occurs, a high voltage pulse appears on pad 143. Acurrent may flow through the p-type doped region 113, the n-type wellregion 111, n-type doped region 115, and diode 131. The PNP transistoris turned on, and a forward bias is provided between the base terminaland the collector terminal of the NPN transistor. A current path isestablished from the n-type well region 111, through the p-type wellregion 101, and n-type source region 103 to the source terminal 141. Asa result, the NPN transistor is triggered and the ESD current can bedirected from the NPN transistor to the source or ground terminal 141.This conduction mechanism does not rely on avalanche breakdown betweenthe n-type well and the p-type well. Therefore, this current conductionis enabled at a lower trigger voltage than conventional npn and SCRstructures, providing better device protection against ESC events. In aspecific embodiment, the trigger voltage of about 24V has been obtainedaccording to an embodiment of the invention. Of course, there can beother variations, modifications, and alternatives.

FIG. 17 is a simplified layout diagram of the high voltage field deviceof FIG. 15 according to an embodiment of the present invention. Thisdiagram is merely an example, which should not unduly limit the scope ofthe claims herein. In FIGS. 15 and 17, corresponding device regions arelabeled with the same numerals. One of ordinary skill in the art wouldrecognize other variations, modifications, and alternatives. As shown,the p-type well region 101 includes the first well contact 102 forcoupling to a ground potential (not shown). The n-type source region 103is located within the p-type well region 101. The n-type well region 111is adjacent to the p-type well region 101 in FIG. 17, and the p-typewell region 101 is shown to be surrounded by the n-type well region 111.

FIG. 18 is a simplified cross-section view diagram of a high voltagefield device according to another embodiment of the present invention.This diagram is merely an example, which should not unduly limit thescope of the claims herein. One of ordinary skill in the art wouldrecognize other variations, modifications, and alternatives. As shown,LDMOS device 1800 is similar to LDMOS device 1500 of FIG. 15, with anRC-triggered MOSFET replacing the diode as the switch device coupled toan ESD current path. In FIG. 18, an ESD current path is provided by anRC triggered MOSFET, including resistor 150, capacitor 153, and n-typeMOSFET 155. According to embodiments of the invention, the resistance ofthe resistor 150 and the capacitance of 153 are selected such thatMOSFET 155 is turned on by the high voltage pulse of an ESD event,providing a current path from the pad through the parasitic forwarddiode and also through MOSFET 155 to a ground potential. During normaldevice operation, MOSFET 155 remains turned off, and no current flowsthrough MOSFET 155. During ESD event, p-type doped region 113, n-typewell region 111, n-type doped region 115, and the RC-triggered MOSFETprovide a current path. This specific embodiment utilizes PN forwarddiode to provide a pnp current flown into P type substrate which raisesthe substrate voltage and helps npn or SCR being turned on while havingan ESD event. The switch and power supply provide a path for PN diode.While an ESD event exists, RC is coupled to the voltage of PAD and MOSis turned on. PNP current path has been formed.

This current flow provides a positive bias at the base-collectorjunction of NPN transistor formed by n-type well region 111, p-type wellregion 101, and n-type doped region 103. The NPN transistor is thentriggered to provide a current path for the ESC current. As discussedabove, this design enables a reduced trigger voltage than conventionalnpn and SCR devices. In an embodiment, MOSFET 155, resistor 150, andcapacitor 153 can be formed in the same semiconductor substrate as theLDMOS using conventional integrated circuit process technology.

FIG. 19 is a simplified schematic diagram of the high voltage fielddevice of FIG. 18 according to an embodiment of the present invention.This diagram is merely an example, which should not unduly limit thescope of the claims herein. One of ordinary skill in the art wouldrecognize other variations, modifications, and alternatives. As shown,the schematic diagram in FIG. 19 is similar to the schematic diagram inFIG. 16, with an RC-triggered MOSFET replacing the diode as the switchdevice coupled to an ESD current path.

FIG. 20 is a simplified layout diagram of the high voltage field deviceof FIG. 18 according to an embodiment of the present invention. Thisdiagram is merely an example, which should not unduly limit the scope ofthe claims herein. One of ordinary skill in the art would recognizeother variations, modifications, and alternatives. As shown, the layoutdiagram in FIG. 20 is similar to the layout diagram in FIG. 17, with anRC-triggered MOSFET replacing the diode as the switch device coupled toan ESD current path.

Although the above has been shown using a selected group of componentsfor providing ESD protection structures having reduced trigger voltages,there can be many alternatives, modifications, and variations. Forexample, some of the components may be expanded and/or combined. Othercomponents may be inserted to those noted above. Depending upon theembodiment, the arrangement of components may be interchanged withothers replaced. Further details of these components are foundthroughout the present specification and more particularly below.

While the preferred embodiments of the invention have been illustratedand described, it will be clear that the invention is not limited tothese embodiments only. Numerous modifications, changes, variations,substitutions and equivalents will be apparent to those skilled in theart without departing from the spirit and scope of the invention asdescribed in the claims.

1. A semiconductor device, comprising: a first well region of a firstconductivity type; a second well region of a second conductive typewithin the first well region; a first region of the first conductivitytype within the second well region; a second region of the secondconductivity type within the second well region; a third region of thefirst conductivity type within the first well region; a fourth region ofthe second conductivity type within the first well region, wherein thethird region and the fourth region are separated by the second wellregion; and a switch device coupled to the third region.
 2. Thesemiconductor device of claim 1, wherein the first region and the secondwell region form a diode, and the first region, the second well region,and the first well form a bipolar transistor.
 3. The semiconductordevice of claim 1, wherein the fourth region and the first well regionform a diode, and the second well region, the first well region, and thefourth region form a bipolar transistor.
 4. The semiconductor device ofclaim 1, wherein the fourth region and the first well region form adiode, and the fourth region, the first well region, the second wellregion, and the first region form a silicon controlled rectifier (SCR).5. The semiconductor device of claim 1, wherein the first region and thesecond region are coupled to a first potential, and the switch device iscoupled to a second potential.
 6. The semiconductor device of claim 5,wherein the first potential is different from the second potential. 7.The semiconductor device of claim 1 wherein the first conductivity typeis n-type, and the second conductivity type is p-type.
 8. Thesemiconductor device of claim 5, wherein the first potential is a groundpotential.
 9. The semiconductor device of claim 1 wherein the switchdevice comprises a diode, a first terminal of the diode being coupled tothe third region and a second terminal of the diode being coupled to thesecond potential.
 10. The semiconductor device of claim 1 wherein theswitch device comprises a MOSFET, a first terminal of the MOSFET beingcoupled to the third region and a second terminal of the MOSFET beingcoupled to the first potential.
 11. The semiconductor device of claim 10wherein a gate terminal of the MOSFET is electrically coupled to thefourth region through a capacitor and electrically coupled to the firstpotential through a resistor.
 12. The semiconductor device of claim 1further comprises a fifth region of the second conductivity type, thefifth region being electrically coupled to the fourth region.
 13. Thesemiconductor device of claim 12, wherein the semiconductor devicecomprises a lateral double diffused MOSFET (LDMOS), the LDMOS including:a channel region in the second well region; a gate dielectric overlyingthe channel region; an isolation region between the channel region andthe fifth region; and a gate overlying the gate dielectric and theisolation region.
 14. The semiconductor device of claim 12, wherein thesemiconductor device comprises a field transistor, the field transistorincluding an isolation region between the first region and the fifthregion.
 15. The semiconductor device of claim 12, wherein thesemiconductor device comprises a MOSFET, the MOSFET further comprising:a channel region in the first well region between the first region andthe fifth region; a gate dielectric overlying the channel region; and agate overlying the gate dielectric, wherein at least a portion of thefifth region is within the first well region.
 16. A semiconductordevice, comprising: an n-type first well; a p-type second well regionwithin the n-type first well region; an n-type first region within thep-type second well region; a p-type second region within the p-typesecond well region; an n-type third region within the n-type first wellregion; a p-type fourth region within the n-type first well region,wherein the n-type third region and the p-type fourth region areseparated by the p-type second well region; and a switch device coupledto the third region.
 17. The semiconductor device of claim 16, whereinthe n-type first region and the p-type second region are coupled to afirst potential, and the switch device is coupled to a second potential.18. The semiconductor device of claim 16, wherein the p-type fourthregion and the n-type first well region form a PN diode, and the p-typefourth region, the n-type first well region and the p-type second wellform a PNP bipolar transistor.
 19. The semiconductor device of claim 16,wherein the p-type second well region and the n-type first region form aPN diode, and the n-type first well region, the p-type second wellregion, and the n-type first region form an NPN bipolar transistor. 20.The semiconductor device of claim 16, wherein the p-type second wellregion and the n-type first region form a PN diode, and the p-typefourth region, the n-type first well region, the p-type second wellregion, and the n-type first region form a silicon controlled rectifier(SCR).
 21. The semiconductor device of claim 16 wherein the switchdevice comprises a diode, a first terminal of the diode being coupled tothe n-type third region and a second terminal of the diode being coupledto the second potential.
 22. The semiconductor device of claim 16,wherein the switch device comprises a MOSFET, a first terminal of theMOSFET being coupled to the n-type third region and a second terminal ofthe MOSFET being coupled to the first potential.
 23. The semiconductordevice of claim 22 wherein a gate terminal of the MOSFET is electricallycoupled to the p-type fourth region through a capacitor and electricallycoupled to a ground potential through a resistor.